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COB technology gaining momentum in LED packaging equipment market

COB technology gaining momentum in LED packaging equipment market

By BizLED Bureau

Apr 14, 2017: At a time when the global LED packaging equipment market is likely to reach $656 million by 2020, with a CAGR growth of 2%, industry experts are exploring the emerging trends of the industry. It has been found that the rise of COB technology is a chief trend that will gain momentum in the LED packaging equipment market.

What is COB?

Chip on Board (COB) is a bare-chip technology used for LED lighting. The lighting unit for a COB LED is carried out by placing numerous LED chips within a small area. It paves way for numerous LED chips to be mounted on the substrate in order to from an LED array in one lighting unit.

This new technology for LED packaging has number of benefits like homogenous luminosity, ability to spread light across a large area, energy efficiency, compactness and effective thermal management. All such benefits have contributed in the popularity of COB LEDs across the industry.

Essentials of LED packaging equipment market

By procedure, as a percentage of the LED packaging equipment market in 2015, die singulation comprised 18.99%, die attach 15.12%, substrate separation 3.88%, permanent bonding 2.33% and LED testing 59.69%.

Die singulation

Also known as wafer dicing division, die singulation was valued at $124.7m in 2015. It is used to divide individual dies on the completed wafer for further packaging and assemblage. The procedure is carried out on the basis of the LED’s end-application. The size of dies, kind of structure, and nature and type of substrates help in establishing the singulation method to be used.

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Other impotant considerations include performance and cost. The development of new laser technologies for scribing and dicing purposes will generate demand for equipment. In addition, it will aid die singulation uphold its market share in the LED packaging equipment market.

LED testing

This segment is required all through the LED packaging procedure, and testing equipment is used for testing end-of-line product , examination and prerequisite of incoming materials and process monitoring and control. The likely boost in demand for LEDs will consequently increase demand for this market segment in the near future.

Substrate separation

The segment was valued at $25.45m in 2015. In order to maintain manufacturing competence, LED makers usually attach multiple LED boards. Next, a punching tool is used to divide the LED boards. Care is required during the procedure, since the printed-circuit board can easily flex owing to extreme stress on the ceramic substrate and the LEDs soldered onto the substrate. Such extreme stress will lead to a crack, creating faulty LEDs.

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Die attach

A number of key processes help in determining the success of a finished product.  Here, it involves the attachment of a die or chip to an LED package. There are some crucial requirements involved in die attach segment and these are

  • thermal conductivity should dispel the heat released from the die;
  • ideal contact should exist between the substrate and die with no voids;
  • the attachment should be made cautiously in order that it does not damage the chip; and
  • the attachment should be able to endure severe temperatures without any deprivation.

Over the past few years, the size of wafers used for LED chip production has increased from 2-4 inches to 6-8 inches. The large wafer size facilitates manufacturers to decrease the overall cost by manufacturing more LED chips per wafer. Increasing price wars have forced manufacturers to highlight cost reduction and a move toward large-diameter wafers for LED production.

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