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JBD develops micro-LED displays using wafer scale monolithic hybrid integration technology

JBD develops micro-LED displays using wafer scale monolithic hybrid integration technology

By BizLED Bureau

Jan 2, 2018: JBD, a Hong Kong based technology startup company, has realized monochromatic red, green and blue active matrix micro-LED (AMµLED) micro-displays with >5,000 dpi pixel density using wafer scale monolithic hybrid integration process.

JBD has developed a monolithic hybrid integration technology. JBD has successfully transferred through wafer bonding after removing substrate removal processes, the functional compound semiconductor epi layers onto Si IC wafers. Such wafer-level blank epi transfer removes the need of precise alignment as required by flip-chip technology, therefore making it high throughput waferlevel process suitable for large volume and low-cost production. The resulted epi-on-IC templates are subsequently subjected to the standard semiconductor fabrication processes with high alignment accuracy to produce monolithic hybrid optoelectronics integrated circuit (OEIC) chips.

Using JBD’s monolithic hybrid integration technology, monochromatic red, green and blue micro-LED micro-displays have been successfully demonstrated on Si based AM micro-display IC backplanes. The AMµLED micro-displays have achieved high resolution with 5µm pixel pitch. The brightness of the AMµLED micro-display (green) demonstrated well exceeds 5x105cd/m2, representing an improvement of over 500-times compared to the existing self-emissive micro-displays. And with further optimization of the device design and fabrication process, JBD’s solution can lead to micro-LED micro-displays with even higher resolution of over 10,000 dpi, which will make the most desirable and promising solution for various wearable electronics and AR applications.

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