Jan 6 13, 2016: Electronics can now be efficiently cooled using graphene-based film, claim researchers from Chalmers University of Technology.
They added that the graphene film has thermal conductivity four times higher than that of copper. The researchers have further developed a graphene film that can be attached to silicon substrates.
A professor at Chalmers University of Technology and the research team leader Johan Liu wrote: ?The methods currently in place, have inconvenienced the researchers making it evident that those methods cannot be used to rid electronic devices off immense amounts of heat, because they consist of only a few layers of thermal conductive atoms.?
?Another problem arises, when you try to add more layers of graphene, a trouble with adhesiveness. The graphene no longer will stick to the surface, after having improved the amount of layers; since the bond is held together only by weak van der Waals bonds,? he added.
He continued, ?We have now solved this dilemma by managing to form strong covalent bonds between the surface and the graphene film, which is an electronic component made of silicon.?
The addition of property altering molecule results in a stronger bond of the graphene. The addition of (3-Aminopropyl) triethoxysilane (APTES) molecules has the required effect, concluded the researchers at Chalmers University of Technology.
The so-called silane bonds are created between the electronic component and graphene through hydrolysis and heating. Johan Liu added that a possible application is the graphene-based film being integrated into lasers, LEDs and radio frequency apparatus for cooling function.