October 21, 2015: ON Semiconductor announced sampling of groundbreaking LED Flicker Mitigation (LFM) technology in a new 2.3 megapixel (MP) CMOS image sensor that sets a new benchmark for automotive Advanced Driver Assistance Systems (ADAS) applications. Capable of capturing 1080p high dynamic range (HDR) video, the AR0231AT also includes features that support Automotive Safety Integrity Level B (ASIL B).
The LFM technology (patent pending) eliminates high frequency LED flicker from traffic signs and vehicle LED lighting and allows Traffic Sign Reading algorithms to operate in all light conditions. The AR0231AT has a 1 / 2.7 in. (6.82 mm) optical format and a 1928 (horizontal) x 1208 (vertical) active pixel array. It uses the latest 3.0 micron Back Side Illuminated (BSI) pixel with ON Semiconductor?s DR-Pix? technology, which offers dual conversion gain for improved performance under all lighting conditions. It captures images in linear, HDR or LFM modes, and offers frame-to-frame context switching between modes.
The new device offers up to 4-exposure HDR, capturing more than 120 dB dynamic range with superior noise performance. The AR0231AT is capable of multi-camera synchronization support to ease implementation in vehicle applications with multiple sensor nodes, and user programmability is achieved via a simple two-wire serial interface. It also has multiple data interfaces including MIPI, parallel and HiSPi. Other key features include selectable automatic or user controlled black level control, spread-spectrum input clock support and multiple color filter array options.
?ON Semiconductor is again demonstrating its market leadership by being the first to deliver samples of a sensor with LFM in the AR0231AT,? said Alvin Wong, senior director, Automotive Imaging and Scanning Division at ON Semiconductor. ?Features that support LFM and ASIL B in a 2.3 MP, 1080p BSI image sensor represent a state of the art combination ideal for high performance automotive ADAS cameras.?
Packaging and availability
The AR0231AT is offered in an 11 mm x 10 mm iBGA-121 package and engineering samples are available now. It has an operating temperature range of -40 to +105 degrees C (ambient) and will be fully AEC-Q100 qualified. It will be available in mass production in 2016.